VIA Technologies Inc and Acreo establish a Wireless Design Center in Sweden

29 May, 2001 - 08:00

VIA Technologies Inc and Acreo establish a Wireless Design Center in Sweden

VIA Technologies, Inc., the world’s leading fabless semiconductor design house headquartered in Taipei, Taiwan, and the Swedish microelectronics institute Acreo, today announced an agreement to co-establish a new design center for wireless applications in Lund, Sweden. 

Taipei, Taiwan/Lund, Sweden, May 29, 2001:

”Our partnership with Acreo offers excellent opportunities for VIA to tap into one of the world’s leading research communities for RF technologies and wireless systems design,” explained Wenchi Chen, President and CEO of VIA Technologies, Inc. “At the same time, VIA will be able to contribute to the community our extensive experience and expertise in rapidly commercializing new technologies and rolling them out onto the global market.”  

”VIA is a dynamic pioneer in the Taiwan PC industry with access to some of the most sophisticated semiconductor processes. Their participation in the new design center will also add a dynamic force inside Socware, our design cluster for System-on-chip-ware”, says Hans Hentzell, president of Acreo.

”The VIA and Acreo cooperation is a part of the Socware business model, that will allow international technology leaders and Swedish companies and research institutions to join a collaborative design cluster in Sweden”, says Rolf Rising, Head of Socware design cluster. ”The location of the Design Center to Lund, close to its University, is a logical step to get access to the university’s leading research and education profile in wireless technologies.”

The center will focus solely on Radio Frequency (“RF”) and Mixed Signal blocks, and will be of strategic value to both VIA and Acreo. It will be the first design center that VIA has established in Europe, and will enable the company to add wireless system application R&D capabilities to its industry-leading PC core logic, x86 processor, communications, networking, and multimedia design expertise.

About VIA Technologies, Inc.VIA Technologies, Inc. is the world's leading fabless supplier of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, as well as cost-effective VIA C3™ processors for Value PCs and Internet Appliances. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000.

Further information can be retrieved from VIA’s web site at

ACREO is a Swedish institute whose expertise within electronics and optics lies in applied research and development. Its different technological development areas are system level integration, interconnect and packaging, imaging, surface characterization, photonics, silicon carbide electronics and micro system technology. Acreo has during several years been in the forefront with technologies for system-on-package (SoP). Now Acreo is adding strategic competence in the area of system-on-chip (SoC) design for wireless applications. Acreo has facilities in Stockholm/Kista, Norrköping and Hudiksvall. The department of System Level Integration is located in Norrköping and will now pioneer the start of Acreo in Lund.

Further information can be retrieved from Acreo’s web site at

Socware design cluster is a Swedish national cooperation involving universities and institutes, Government ministries, authorities and institutions as well as business and industry in a USD 60 million investment. Invest in Sweden Agency (ISA) serves as the business platform for Socware.

Further information can be retrieved from the Socware or ISA web site at or

VIA press contacts:

  • US: Paul Ayscoughpayscough [at], +1 408 588 8309
  • International:  Richard Brown Richard_Brown [at], + 886 2 2218 5452 #6201  

Note to reporters, editors and writers: VIA is spelled in ALL CAPS.

ACREO press contacts:

  • Hans Hentzell, President, ACREO AB hans.hentzell [at], + 46 8 632 77 00
  • Magnus Danestig, Manager Dept of System Level IntegrationAcreo AB and Norrköping Socware Center magnus.danestig [at], +46 11 36 36 10
  • Tommy Skoog, Project Manager Lund Socware Centertommy.skoog [at], +46 8 632 77 91

Socware and ISA press contacts:

  • Rolf Rising, Head of Socware, Invest in Sweden Agencyrolf.rising [at], +46 70 634 08 20
  • Annika Rembe, Head of Market Communications, Invest in Sweden Agency annika.rembe [at], +46 8 402 78 16